We are excited to announce that Wunderlich-Malec will be attending PACK EXPO International 2024! Join us at Booth #W-18107, where we will showcase our latest innovations in packaging and processing solutions. This event, happening from November 3-6, 2024, at McCormick Place in Chicago, is a must-attend for anyone in the industry.
Don’t miss the opportunity to explore cutting-edge technology, see machinery in action, and gain insights from industry experts. Register today for free using our comp code 46T56!
Event Details:
- Date: November 3-6, 2024
- Location: McCormick Place, Chicago
- Booth: W-18107
We look forward to seeing you there!